Published by:
CGP EDU Academic Team
Published on: August 13, 2026
In the silver plating of copper, 
is used instead of 
. The reason is
A
a thin layer of Ag is formed on 
B
more voltage is required
C
ions are completely removed from solution
D
less availability of 
ions, as Cu can not displace Ag from 
ion
ions, as Cu can not displace Ag from ion
Text Solution
Verified by ExpertsThe correct answer is:
D
Copper being more electropositive readily precipitate silver from their salt 
solution. 
In 
solution a complex anion 
is formed so 
ions are less available in the solution and Cu cannot displace Ag from this complex ion.
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